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Data I/O to Showcase Award-Winning UFS Programming Technology at NEPCON China
Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced data programming and security provisioning solutions for flash, flash-memory based intelligent devices and microcontrollers, will showcase its award-winning UFS device programming technology on the Lumen™X in Booth #1A32 at NEPCON China, scheduled to take place April 24th – 26th at the Shanghai World Expo Exhibition & Convention Center. “New requirements for faster performance, improved responsiveness and growing file sizes for IoT devices, the connected car and wireless applications are driving adoption of Universal Flash Storage (UFS), the next-generation flash memory,” said Doctor Ma Qinghua, General Manager of Data I/O China. “These applications are transitioning from eMMC flash to UFS. China electronics manufacturers are faced with an extraordinary challenge to manage exponential growth in content and transition to new Flash Memory technology while maintaining production throughput. Traditional methods of programming no longer apply to today’s electronics markets. Data I/O is thrilled to extend support on LumenX for UFS devices delivering maximum performance, flexibility and throughput for the lowest total cost to our customers.” The LumenX programming platform is architected to support the latest device technologies for maximum performance today and in the future. Data I/O’s UFS support delivers optimal programming performance, capacity and manageability to meet high-volume production demands while delivering the lowest total cost of ownership. UFS support is available on the LumenX Desktop or integrated into the PSV5000 and PSV7000 automated programming systems. Existing PSV customers can protect their investments and easily upgrade their PSV systems to support UFS as their production requirements change. The combination of LumenX programming technology in a PSV system delivers the maximum performance, flexibility and throughput for the lowest total cost.

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