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AIM to Highlight REL61™ & REL22™ at SMTA West Penn Expo on March 28th, 2018

AIM to Highlight REL61™ & REL22™ at SMTA West Penn Expo on March 28th, 2018
14/03/2018

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces their participation at the SMTA West Penn Expo & Tech Forum, scheduled to take place March 28th, 2018 at the DoubleTree Monroeville Hotel in Monroeville, PA. AIM will highlight their revolutionary REL61™ and award-winning REL22™ lead-free alloys along with their full line of solder assembly materials.

REL61 was developed to provide PCB assemblers and designers with an enhanced reliability, cost-effective replacement for SAC305 and other low/no silver alloys. REL61 outperforms all common lead-free alloys in durability, wetting performance, thermal cycling performance, and BTC void performance. Available in paste, wire and bar solder formats, REL61 can be incorporated into all phases of PCB assembly.

AIM will also highlight its full line of advanced solder materials, including its solder paste, liquid flux solder alloys, and its newly developed and award-winning REL22 solder alloy for extremely harsh environments. To discover all of AIM’s products and services, visit the company at the SMTA West Penn Expo & Tech Forum for more information.

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