Verti-P High-Parallel Conical Micro-Spring Pin Wafer Probing Solution

Verti-P High-Parallel Conical Micro-Spring Pin Wafer Probing Solution

Advanced semiconductor probing services including vertical micro-spring probe systems (for WLCSP and ICs), high-frequency and high-temperature Verti-M pin technology, cantilever probe cards (memory, imagers), and precision parametric probing solutions. Ideal for multi-site, fine-pitch, low-leakage, and high-parallel wafer test and characterization applications.

For more information on Verti-P High-Parallel Conical Micro-Spring Pin Wafer Probing Solution talk to Synergie-Cad (UK) Ltd