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Multi-Die Cantilever Probe Card Solutions For Fine-Pitch Devices
Advanced semiconductor probing services including vertical micro-spring probe systems (for WLCSP and ICs), high-frequency and high-temperature Verti-M pin technology, cantilever probe cards (memory, imagers), and precision parametric probing solutions. Ideal for multi-site, fine-pitch, low-leakage, and high-parallel wafer test and characterization applications.
Advanced semiconductor probing services including vertical micro-spring probe systems (for WLCSP and ICs), high-frequency and high-temperature Verti-M pin technology, cantilever probe cards (memory, imagers), and precision parametric probing solutions. Ideal for multi-site, fine-pitch, low-leakage, and high-parallel wafer test and characterization applications.
For more information on Multi-Die Cantilever Probe Card Solutions For Fine-Pitch Devices talk to Synergie-Cad (UK) Ltd
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