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Spring can take your existing through-hole PCB designs and convert them into modern surface mount layouts, ready for fast, automated and far more cost-effective production on a surface mount assembly line.
We can also refresh older surface mount designs that use legacy packages such as 0805 and SOIC, updating them to smaller, more efficient formats including 0402, BGA or QFP. This not only reduces board size and material costs but also improves manufacturability and long-term availability of components.
Once the redesign is complete, we can seamlessly move the updated product into full manufacture, handling the transition from legacy design to modern production with minimal disruption.
For more information on Conversion To Surface Mount talk to Spring (Europe) Ltd