In addition to the above, PSL Group has been producing heatsink products for around 25 years and has become a leader in Thermal Management Solutions utilising Bonded Fin technology for Air Cooling, and Embedded Pipe technology for Liquid Cooling. These products supplement a wide range of standard profiles available up to 750mm wide; providing our customers with a wide range of solutions both in terms of thermal performance and physical size.

By combining the products from our dedicated supply partners together with heatsinks of our own design, PSL Group also design and manufacture a diverse range of Thyristor / Diode and IGBT assemblies for various customer applications and industries. Our in-house design team are able to work closely with client engineers with the aim of producing the most cost effective solution in the least possible time, meaning PSL Group are ideally placed to support your assembly requirements.