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IGBT Power Module Packaging Solutions
Here at Interplex, our application specific solutions suitable for the packaging of IGBT power modules and complete power stack assemblies utilizing a number of proven core high-force, high-power, pluggable interconnect technologies, including press-fit, IDC (Insulation Displacement Connectors), tuning forks and other products.

For more information on IGBT Power Module Packaging Solutions talk to Interplex Select Moulds Ltd

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