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NEO Tech Releases New LTCC & AlN Design Guidelines

NEO Tech Releases New LTCC & AlN Design Guidelines
15/03/2018

NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and aerospace & defense markets, announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.

NEO Tech has emerged as North America’s leading manufacturer of high-reliability LTCC and high-temperature co-fired (HTCC) substrates and packages. These fabrication technologies provide unique solutions for high interconnect density, compact packages and high-frequency applications.

Key advantages include: Embedded passive components High density interconnect Cost-competitive plated Silver systems TCE closely matches that of Si, GaAs and SiC (and other associated compounds) Brazed on components (connectors, seal ring, heat spreaders) Hermetic packaging Outstanding long-term reliability

The guidelines include comprehensive information that highlight capabilities, overview and standard design considerations, which include conductors, vias, cavities, special high-frequency design provisions, capacitors, inductors, post-fired conductors, soldering, material thermal properties, and electrical and mechanical properties of LTCC.

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