search

Hybrid Circuit Assembly

Hybrid Circuit Assembly

The facilities in the hybrid assembly clean area include: test; die bonding; wire bonding; burn-in; precision assembly; and environmental stress screening. Packaging is particularly important, to make sure that the product will meet the required environmental and performance specification. A range of different substrate types are used, including co-fired ceramic, thick film alumina, FR4 and more specialised materials.

For more information on  Hybrid Circuit Assembly  talk to  PRP Optoelectronics Ltd

Enquiry Form



More Products

Reticule Micro-Display Solutions

Reticule Micro-Display Solutions

We offer an innovative Reticule Micro-Display. This technology enables the creation of monolithic X-Y matrix chips, for example, a single chip consis...

Read More
LED Military Display Solutions

LED Military Display Solutions

Features: • Hybrid LED array • Wide viewing angle • Sunlight readable • Wide operating temperature range • High reliability • Compact mechanical desi...

Read More
Avionic LED Display Solutions

Avionic LED Display Solutions

Features include: • Compact mechanical design • Simple interfacing • Low power • Wide dynamic range • Very fast response • NVG compatibility

Read More

Read More

Read More

List your business

Would you like to register your company on one of the UK's largest and most effective Trade websites?

Are you looking for a reliable and consistent source of enquiries from your industry sector? Would you like to see why Find the Needle clients come back year after year to use our service? If so then feel free to register using the link 'here'.

Register
Office Address: