SRO Perfect Vacuum Soldering Systems

For Thermal Transfer Applications requiring processing under vacuum, or with process gases, including Void Free Solder Reflow, Package Lid Sealing, Annealing Die Attach & Substrate Bonding, Alloying, Flip Chip / Thermocompression Wafer Bonding, Flip Chip Bump Reflow, Popcorn Effect Analysing & other rapid thermal processes etc.

For more information on SRO Perfect Vacuum Soldering Systems talk to Inseto (UK) Ltd