Multi-Layer Co-Fired Ceramic Packages

Multi-Layer Co-Fired Ceramic Packages - Single Chip and Multi Chip Substrates for low and medium volume applications. Capabilities include Pins, Seal-Frames & Packages as large as four inches square and between 2 and 30 layers of circuitry.

For more information on Multi-Layer Co-Fired Ceramic Packages talk to Inseto (UK) Ltd