Gold, Aluminium & Copper Bonding Wire & Ribbons

Coining manufacture aluminium, copper or gold based bonding wires & ribbons that are widely used in the manufacturing of microelectronic and semiconductor devices as the electrical interconnect either between a chip and substrate or between two chips. All materials used by Coining (Formerly SPM - Semiconductor Packaging Materials) are of the highest quality, refined and alloyed to produce the properties demanded of finished wire and ribbon products.

For more information on Gold, Aluminium & Copper Bonding Wire & Ribbons talk to Inseto (UK) Ltd