Flexible Microelectronics Assembly & Die Bonding Systems By Amadyne

FAB - Fast Automatic Bonder offers improved speed and accuracy and incorporates the very latest in motion control & software technology, whilst not compromising on flexibility. The system is housed inside a novel cabinet, which incorporates particular control filters, system status illuminators and an exceptional working area that can accommodate up to two wafers for parallel processing. System features include: - Elegant Graphical User Interface - Large Working Area - High Pick & Place Accuracy - Automatic Dispense Module Change - Customer Specific Integration - Single & Multiple Cell Configurations - Inline Capable

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