3D Interconnection Devices

These 3D interconnection devices are made with thin-film metalisation and high-precision laser ablation techniques on ceramic carriers, and provide excellent electrical insulation, high thermal dissipation and superior dimensional stability. Tracks are selectively laser-etched to 50µm width with 100µm gaps, and metalisation of Ti/Pt/Au or Cr/Ni/Au is deposited using PACVD technology.

For more information on 3D Interconnection Devices talk to Inseto (UK) Ltd