III/V Compound Analysis

Particles EDX, WDX analysis (good first option). Quantitative spectra and chemical mapping. Lateral resolution limited to ~1 micron. Auger analysis: Quantitative spectra and imaging. Excellent lateral resolution (0.1 microns) for small area analysis. Metallic Contaminants VPD-ICPMS (or VPD-TXRF). Detection limits of ~1e7 atoms/ cm2 (ppb range). All elements including the light species (e.g. Li, Na, Ca, K, Al). VPD-ICPMS allowing the analysis for the entire range the periodic table in a single run (cf. TXRF using several runs). SIMS (near surface and bulk) impurities & gaseous species. Organic Contaminants TOF SIMS: “Relative" quantification and high resolution chemical imaging. Retrospective extraction of “spectra” from “individual pixels” in imaging mode. Ideal for detection of sub monolayer organic and inorganics. Sensitivity ppm – ppb range. XPS: Quantitative technique providing “chemical state” information and imaging. Detection limits ~0.1 atom %. Sub Surface Defects & Contaminants Cross Sectional microscopy (TEM) analysis. Combined with electron diffraction and EELS mapping. FIB analysis. SEM, EDX & WDX FTIR & Raman analysis. TOF SIMS depth profiling. High sensitivity, parallel detection.

For more information on III/V Compound Analysis talk to Aystorm Scientific Ltd