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Lead Free Solder Powder SnAgCu For Electronics Assembly
Qualitek offers premium solder powder — including lead-free Sn-Ag-Cu alloys — ideal for manufacturing solder paste for PCB assembly, reflow, and high-reliability electronics. Our fine-particle solder powders (20-40 µm) deliver precise flux mixing, consistent wetting and excellent joint strength. Quality-controlled and suitable for industrial SMT and PCB production.
Qualitek offers premium solder powder — including lead-free Sn-Ag-Cu alloys — ideal for manufacturing solder paste for PCB assembly, reflow, and high-reliability electronics. Our fine-particle solder powders (20-40 µm) deliver precise flux mixing, consistent wetting and excellent joint strength. Quality-controlled and suitable for industrial SMT and PCB production.
For more information on Lead Free Solder Powder SnAgCu For Electronics Assembly talk to Qualitek Europe Ltd
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