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Fine Solder Powder 20-40 Micron For SMT Paste Mixing
Qualitek offers premium solder powder — including lead-free Sn-Ag-Cu alloys — ideal for manufacturing solder paste for PCB assembly, reflow, and high-reliability electronics. Our fine-particle solder powders (20-40 µm) deliver precise flux mixing, consistent wetting and excellent joint strength. Quality-controlled and suitable for industrial SMT and PCB production.
Qualitek offers premium solder powder — including lead-free Sn-Ag-Cu alloys — ideal for manufacturing solder paste for PCB assembly, reflow, and high-reliability electronics. Our fine-particle solder powders (20-40 µm) deliver precise flux mixing, consistent wetting and excellent joint strength. Quality-controlled and suitable for industrial SMT and PCB production.
For more information on Fine Solder Powder 20-40 Micron For SMT Paste Mixing talk to Qualitek Europe Ltd
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