IPM. SKiiP Semikron Intelligent Power Modules.

SKiiP 4 IPM - Sintered chips - for high operation temperatures Mechanically compatible to SKiiP®3 Intelligent Power Module: IPM 3 in 1: Driver, semiconductor, cooling 400 kW - 1,8 MW 33% more power, same volume 5 x higher thermal cycling capability Sintered chips - for high operation temperatures Intelligent Power Module: IPM 3 in 1: Driver, semiconductor, cooling 400 kW - 1,8 MW 33% more power, same volume 5 x higher thermal cycling capability Sintered chips - for high operation temperatures Unbreakable sinter joint: Melting temp. is 6 x higher than operating temperatures

For more information on IPM. SKiiP Semikron Intelligent Power Modules. talk to Power Products International Ltd