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Low Thermal Expansion Encapsulation
Low Thermal Expansion Encapsulation

Professional encapsulation services using epoxy, urethane, and silicone systems with 21 years' experience. Specializing in vacuum encapsulation with high dielectric strength (17kV/mm), excellent thermal dissipation, low thermal expansion, and dimensional stability under 100µm. Ideal for electronic, industrial, and high-voltage applications. Reliable, precise, and durable protection for sensitive components.

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