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Bespoke Encapsulation Solutions
Encapsulating components using epoxy resin, urethane, and silicone systems. We have 21 years' experience in vacuum encapsulation, using thermal and room temperature curing epoxy systems which offer excellent dielectric properties, typically 17kVmm is achieved in all processes. High thermal dissipation performance, low thermal expansion coefficient and dimensional stable tolerances of <100um.
Encapsulating components using epoxy resin, urethane, and silicone systems. We have 21 years' experience in vacuum encapsulation, using thermal and room temperature curing epoxy systems which offer excellent dielectric properties, typically 17kVmm is achieved in all processes. High thermal dissipation performance, low thermal expansion coefficient and dimensional stable tolerances of <100um.
For more information on Bespoke Encapsulation Solutions talk to PLEXNETIC LTD
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