Surface Mount Technology, Rapid prototype assembly - NPI

If accuracy, versatility and speed are paramount then our Juki surface mount lines offer the capability. Patronics has designed its surface mount facilities so that they can support rapid prototype/NPI builds whilst maintaining maximum through put for production assembly. Rapid prototype assembly - NPI medium batch and high volume surface mount assembly BGA Micro BGA CCGA CSP’s 16 Zone double and single side reflow Placement capability down to 01005 Flip Chip MCMs MEMs Complex Connectors (150mm x 0.3mm pitch) 50,000 component placements p/h Soldering Our highly accurate enclosed head, solder paste, screen printing systems with automated 2-D inspection at the input to the SMT process and utilising the Gridlock tooling system which allows for full under-board support and ease of setup. This system gives high levels of consistency for both paste and pump print stencil screening.

For more information on Surface Mount Technology, Rapid prototype assembly - NPI talk to Patronics International Ltd