Thermal Interface Materials (TIM)

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Specialty Features •High-temperature operation at 250° C continuous •Low/no outgassing for vacuum environments •High dielectric strength •Easy to clean: water while retaining good moisture resistance •Ultra-thin bond line for minimum thermal resistance

For more information on Thermal Interface Materials (TIM) talk to Nordson EFD