XBS200 Wafer Bonder

We are the leading UK supplier of XBS200 Wafer Bonder. The XBS200 platform from SUSS MicroTec allows for fully automatic aligned wafer bonding of materials up to 200 mm in diameter. Its versatile, modular design offers maximum process flexibility in all permanent bonding tasks. Call on +44 (0)1264 334505 to know more about XBS200 Wafer Bonder!

For more information on XBS200 Wafer Bonder talk to Inseto (UK) Ltd