XB8 Wafer Bonder

We are a premium supplier of XB8 Wafer Bonder in the UK. The XB8 from SUSS MicroTec has been developed to support a wide range of bonding processes wafers up to 200 mm in diameter. Flexible, adaptable with a comprehensive range of adjustable process parameters, the XB8 wafer bonder from SUSS MicroTec is an ideal Research & Development tool. For any query on XB8 Wafer Bonder, please contact us on +44 (0)1264 334505!

For more information on XB8 Wafer Bonder talk to Inseto (UK) Ltd