SB6/8 GEN2 Wafer Bonder

We are the top supplier of SB6/8 GEN2 Wafer Bonder in the UK. The SB6/8 Gen2 from SUSS MicroTec is the state of the art universal wafer bonder for substrates, irregular pieces and wafers up to 200mm in diameter. Supported bonding processes include: Adhesive Bonding, Anodic, Eutectic or Fusion Bonding, Glass Frit processes and Temporary Wafer Bonding. Call on +44 (0)1264 334505 to know more about SB6/8 GEN2 Wafer Bonder!

For more information on SB6/8 GEN2 Wafer Bonder talk to Inseto (UK) Ltd