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For Reflow Soldering, Brazing, Pre-Heating, Annealing, Curing, Baking, Bonding & Eutectic Reflow Solder applications. Simple to use, extremely reliable and robust, excellent temperature uniformity, rapid ramping, vacuum clamping, maximum temperature 360°C/450°C with higher versions & customised requirements on request.
For more information on High Precision Hot Plates & Chucks talk to Inseto (UK) Ltd
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