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Semiconductor Packaging Materials (SPM), a Coining Company, are a diverse world class manufacturer of interconnect solutions for the microelectronics industry. Their products are currently divided into several product groups: bonding wire & ribbon in gold, silver, aluminium, copper etc.; precision stampings in a wide range of metals; clad to other metals or solder alloys; and preforms and ribbon in all solder compositions.
For more information on Bonding Wire & Ribbon talk to Inseto (UK) Ltd
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