Thermal Management & Interface Materials

Thermal Adhesives and Thermal Interface Materials: Thermal Gels (COOL-GEL®), Thermal Greases (COOL-GREASE®) and Phase-Change and Compressible Thermal Pad (COOL-PAD™) and in-situ bonding pressure sensitive film pad and high thermal adhesives (COOL-BOND®): AIT pioneered the use of flexible thermal adhesives and phase-change materials as thermal interface materials (TIM) including thermal pads (COOL-PAD™) and the patented compressible phase-change material in the thermal management of microprocessors of personal computers, power converters and supplies. COOL-PAD™ is a phase-change thermal interface pad material that handles like a plastic sheet but flows and performs like a grease during device operation and shows 200-600% improvement observed in usage.

For more information on Thermal Management & Interface Materials talk to Epak Electronics Ltd