HYBRID ALUMINA/GLASS WALLED ELECTRONIC PACKAGES

Mini-Systems Inc (MSI) Electronic Package Division offer high performance, alumina/glass walled packages and lids in flat pack, plug-in and surface mount configurations for microwave applications. The range of packages have been specifically designed for aerospace, telecommunication, opto-electronic, hybrid, crystal oscillator & industrial applications. The package types include glass wall & metal flat packs, plug-ins, gull wing & J-leaded chip carriers, machine microwave & surface mount microwave packages and TO8 packages. A full custom package service is available to suit all applications. Alumina/Glass Sidewall Packages As well as setting the pace for Alumina/Glass sidewall packages, our Package Division also offers the same surpassing abilities in the manufacturing of products designed to meet all other package requirements. Our customers/partners may also benefit from our offering of a complete line of matching lids as Combo Lids, Stepped Lids, and Domed Covers. For additional information or if you require assistance in finding a package to suit your specific requirements feel free to e-mail us or contact us. Glass Flat-Packages, Glass Flat-packages (Cut & Formed), Plug-Ins, Metal Flat Packages, also T08 cans

For more information on HYBRID ALUMINA/GLASS WALLED ELECTRONIC PACKAGES talk to Epak Electronics Ltd