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VAC745 / VAC765 Solder Equipment Suppliers
Void-free solder joints with highest quality Maximum board sizes: VAC745: 635 x 444mm VAC765: 635 x 644mm Special Features 15? touch Windows HMI Screen (Network Capability) Vacuum process in the vapour phase for void-free soldering ( patented) Automatic monitoring of vacuum process (pressure monitoring) IPS Intelligent profilling system TRS temperature recording and analysis softwa Pilot mode (PCB- temperature recording and Analysis software) Pilot-mode (PCB-Temperatute controlled process
Please contact us for more information on our VAC745 / VAC765 Solder Equipment Suppliers
Void-free solder joints with highest quality Maximum board sizes: VAC745: 635 x 444mm VAC765: 635 x 644mm Special Features 15? touch Windows HMI Screen (Network Capability) Vacuum process in the vapour phase for void-free soldering ( patented) Automatic monitoring of vacuum process (pressure monitoring) IPS Intelligent profilling system TRS temperature recording and analysis softwa Pilot mode (PCB- temperature recording and Analysis software) Pilot-mode (PCB-Temperatute controlled process
Please contact us for more information on our VAC745 / VAC765 Solder Equipment Suppliers
For more information on VAC745 / VAC765 Solder Equipment Suppliers talk to Blundell Production Equipment
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