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placeALL® 620 Solder Equipment
Like the placeALL®520, the placeALL®620 has a modular structure and is used for the production of small series up to medium lots. The range of components from chips up to type 0201, FP components and BGAs up to grid 0.3 mm and max. 70 x 70 mm outer dimensions can be processed safely. An optional 2nd placement head can even increase production by up to 40 %. 208 possible feed positions and intelligent software reduce the machine setup. The "smartLINE” combination with dispensing or other automatic placement machines not only increases the feeder capacity but above all the output of the machine.
Please contact us for more information on our placeALL® 620 Solder Equipment
Like the placeALL®520, the placeALL®620 has a modular structure and is used for the production of small series up to medium lots. The range of components from chips up to type 0201, FP components and BGAs up to grid 0.3 mm and max. 70 x 70 mm outer dimensions can be processed safely. An optional 2nd placement head can even increase production by up to 40 %. 208 possible feed positions and intelligent software reduce the machine setup. The "smartLINE” combination with dispensing or other automatic placement machines not only increases the feeder capacity but above all the output of the machine.
Please contact us for more information on our placeALL® 620 Solder Equipment
For more information on placeALL® 620 Solder Equipment talk to Blundell Production Equipment
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