Burn-In systems Specialist Suplier

Synergie CAD achieved a significant milestone when, a few years ago, it developed and completed a full line of Burn-In systems.SYNERGIE CAD develops and manufacturesDriver BoardsMore than 400 BIB systems running with SYNERGIE CAD driversInterface BoardsBurn-In Boards -> Complete Burn-In Systems Engineering Oven with 30 slotsProduction Oven with 60 slotsInterface SW “Universal Driver Superviser”Combined with userfriendly and highly programmable burn-in drivers, our Burn-In systems integrate most functions traditionally found in expensive ATE equipment at a fraction of the cost.Burn-in ovens are designed for dynamic and static burn-in of integrated circuits and other electronic devices. Typical sizes are from under ten to over 30 cubic feet (0.85 m3), with air or nitrogen configurations. Operating temperatures can go over 260 degrees Celsius (500 degrees Fahrenheit), and can use both single and multiple temperature settings. Burn-in oven applications can be used in numerous different applications such as high-dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of microprocessors and other semiconductor devices. Burn-in ovens are considered a type of batch oven. Other types of batch ovens are bench/laboratory, reach-in, walk in/truck in, and clean process.

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