Microelectronic Applications

Microelectronic Applications - DELO produce a variety of high purity materials for assembly processes including die attach, glob-top encapsulants, dam / fill materials, flip chip underfill materials, plus light activated and light cured adhesives for encapsulation, sealing and joining: Die Attach Adhesives Glob Top and Encapsulation

For more information on Microelectronic Applications talk to Inseto (UK) Ltd