Bond Testing Systems By Nordson DAGE

Nordson DAGE have a strong portfolio of products for destructive and non-destructive mechanical testing and inspection of electronic components including wire pull, bond shear, die shear, tweezer & stud pull, fatigue testing etc. With their self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as BGAs, Chip Scale Packages (CSP) and other electronic components. Their commitment to continuous development has ensured that products are brought swiftly to market to support customers in emerging technology sectors. A philosophy that has most recently led to the development of products for 300 mm wafer bump shear.

For more information on Bond Testing Systems By Nordson DAGE talk to Inseto (UK) Ltd