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R&D Product Failure Analysis

R&D Product Failure Analysis

ITRI Innovation has extensive experience in performing failure analysis on a wide range of component parts and products (sensors, medical implants, optical devices engineering parts, ball grid arrays, printed wiring boards, photodiodes, plastic encapsulated microcircuits, connectors, flip-chips, etc.) and identifying a wide range of failure mechanisms.

It is ITRI's philosophy that failure analysis is a systematic examination of failed devices to determine the root cause and to use such information to eventually improve product reliability.

Failure analysis is designed to: identify the failure modes (the way the product failed); identify the failure site (where in the product failure occurred); identify the failure mechanism (the physical phenomena involved in the failure); determine the root cause (the design, defect, or loads which led to failure); and recommend failure prevention methods

The process begins with the most non-destructive techniques and then proceeds to the more destructive techniques, allowing the gathering of unique data from each technique throughout the process. This data when properly analyzed leads to a viable mechanism for the failure.

The use of destructive techniques early in the process is discouraged as it can result in the loss of valuable information that might be required later. The recommended sequence of procedures is:

Visual Inspection Electrical Testing Non-Destructive Evaluation Destructive Evaluation (using relevant techniques) Understanding the physics of failure allows our clients the opportunity to select materials and package design attributes, which minimize the susceptibility of future designs to failure by the mechanisms identified in the degradation assessment.

In addition, it allows the user to select environmental and operational loads that minimize the susceptibility of the current design to failure during storage or use.

For more information on  R&D Product Failure Analysis  talk to  ITRI Innovation

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