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UK IPC Day Invitation

UK IPC Day Invitation
26/07/2019

Advanced Rework Technology Ltd are proud and pleased to announce they are working with IPC to host the first IPC Day to be held in the UK.

IPC Days are a great way to network with peers, colleagues and likeminded industry professionals. IPC and ART Ltd are inviting companies within the electronics industry to attend this complimentary event.

The first ever UK IPC day is based around Understanding Failures for Improved Reliability, and implementing IPC Documents and Standards for High Reliability products.

Event details 3 December 2018

Venue: IHS-Markit-Global HQ London: 4th floor Ropemaker Place, 25 Ropemaker Street, London, EC2Y 9LY, UK

Price: Free of charge but advance registration is essential.

Registration: To register, please send an email to info@rework.co.uk no later than Friday 30 November 2018.

9 :30 – Registration and Welcome tea & coffee 10: 00 – Welcome: Ms Debbie Wade, Master IPC Trainer MIT, Advanced Rework Technology Ltd., Mr Simon Alcock, Director Partnerships and Products, Engineering and Product Design, IHS-Markit & Philippe Léonard, IPC Europe Director. 11 :00 – Keynote Speaker: Mr Bhanu Sood, NASA, Risk Assessment Engineer 13 :00 – Networking lunch 14:00 – Keynote Speaker: Mr Bhanu Sood, NASA, Risk Assessment Engineer – Continued 15: 00 – Q&A and open discussion: Ms Debbie Wade, Master IPC Trainer MIT, Advanced Rework Technology Ltd – Audience expressing needs: topics for next meeting 16 :00 – Conclusions and close. Keynote Speaker Bio: Mr. Bhanu Sood is a Commodity Risk Assessment Engineer at NASA Goddard Space Flight Center. Mr. Sood serves as the Goddard Center lead and NASA Specialist managing overall development efforts pertaining to risk and reliability of Microelectronics Packaging and Printed Circuit Boards used in NASA Goddard’s flight missions and ground support equipment. At Goddard, Mr. Sood has developed and evaluated microelectronics and PCBs for missions such as Joint Polar Satellite System (JPSS), LandSat, Transiting Exoplanet Survey Satellite (TESS) and Asteroid Sample Return Mission (OSIRIS-Rex). Prior to joining NASA, Mr. Sood was the Laboratory Director at University of Maryland’s Center for Advanced Life Cycle Engineering (CALCE) where he provided reliability and supply chain risk consultation services to organizations from the aerospace, avionics, medical device, telecommunications, oil/gas and automotive industries. Mr. Sood has authored several hundred conference papers, presentations and technical reports, four book chapters and thirty-two peer reviewed scholarly and technical manuscripts.

Keynote Presentation Outline This tutorial will discuss a wide range of failure mechanisms that effect the functionality of PCBs under varied stress conditions. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. With the help of examples and case studies, a wide range of failure mechanisms will be discussed, case studies are focused on digital circuits, however some failures in analog, double sided boards are also presented. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues.

Additional Speakers: Debbie Wade, Advanced Rework Technology Ltd, Master IPC Trainer and Chair of the European IPC Standards Steering Committee, European IPC Training Committee and Vice-chair of IPC Product Assurance will be on-hand to discuss which IPC Documents and Standards compliment class 3 High Reliability/Harsh Environment Products (including IPC Space Addendums), involvement with standards development and IPC Committee participation.

Mr Simon Alcock, Director Partnerships and Products, Engineering and Product Design, IHS-Markit

For more information follow this link: UK IPC Day Invitation

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